💻 Semiconductor & Vacuum

Capabilities at a Glance

Tolerance±0.005mm on critical dimensions
MaterialsAluminum 6061 · Stainless 304L/316L · Titanium · Oxygen-free copper · Engineering plastics. Full material certs available for traceability.
Process5-Axis CNC Milling
Surface FinishBead Blasting · Passivation · Electroless Nickel (available on request); clean-room machining and packaging on request
InspectionZeiss CMM · Cpk ≥ 1.33 · Free FAI
Lead TimeUHV fittings 3–5 months; semiconductor parts 4–8 months; prototypes faster. DDP door-to-door with one invoice.

Frequently Asked Questions

  • Can you machine vacuum chamber components?

    Yes. Vacuum chamber components, wafer handling parts and process kit components are machined from aluminum 6061, stainless 316L and engineering plastics with tight sealing-surface tolerances.

  • How do you machine UHV sealing surfaces?

    UHV flange faces (CF, KF, ISO) are machined to a fine surface finish with controlled flatness for reliable sealing. Clean-room machining and packaging available on request.

  • What materials do you use for semiconductor parts?

    Aluminum 6061, stainless 304L/316L, titanium, oxygen-free copper and engineering plastics, with full material certs available for traceability.

  • How do you avoid contamination in machined parts?

    Parts are machined with clean process control, washed, and packaged per your cleanliness spec. We follow your handling and packaging instructions on every lot.

  • What tolerances do you hold on wafer handling and vacuum parts?

    ±0.005mm on critical dimensions — flange seal faces, mating bores and alignment features — verified on Zeiss CMM with full report.

  • What is the lead time for vacuum fittings?

    3–5 months for UHV fittings and 4–8 months for semiconductor equipment parts depending on complexity and quantity; prototypes ship faster.

Buyer's Guide

  • How to Request a Quote for Semiconductor & Vacuum Parts

    Send the drawing with: vacuum rating (HV/UHV), sealing surface requirements, material, cleanliness level, and quantity. Vacuum level drives the finish and material spec.

  • Material Selection Guide

    Stainless 304L/316L for UHV chambers and fittings, aluminum 6061 for weight-sensitive hardware, oxygen-free copper for RF and thermal paths, engineering plastics for insulators.

  • DFM Tips for Vacuum Parts

    Design sealing faces with enough land width, avoid trapped volumes and sharp edges that collect particles, and specify surface roughness explicitly for seal reliability.

  • Quality & Inspection

    Zeiss CMM inspection with full report, Cpk ≥ 1.33, free FAI, material certs available. Cleanliness and packaging handled per your spec.

  • Lead Time & Shipping

    UHV fittings 3–5 months, semiconductor parts 4–8 months, prototypes faster. DDP door-to-door with one invoice — export, customs, duties, last-mile.

Request a Quote for Semiconductor & Vacuum

Send us your drawing — we review within 24h and return a quote with lead time.

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